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Manufacturing capabilities |
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| Specification | Value | | Track-to-Track Clearance | 0.20mm (8 mil) | | Track Width | 0.20mm (8 mil) | | Minimum feature to board outline | 0.25mm (10 mil) | | Silkscreen width | 0.20mm (8 mil) | | Board outline | 0.20mm (8 mil) | | Minimum Annular ring size | 0.20mm (8 mil) | | Solder mask expansion | 0.15mm (6 mil) | | Minimum via hole size (first drilled 0.6mm) | 0.5 mm (20mil)
| | Minimum hole size | 0.6 mm (24mil)
| | Hole diameter tolerance | <0.05mm (2mil)
| | Maximum single sided board size | 500mm x 400mm | | Maximum through hole plated board size | 500mm x 400mm |
Depending on the design, certain manufacturing guidelines can be exceeded, should you require a printed circuit board with specifications not listed above, please enquire prior to your order.
Product Specifications: | Product | Single Sided, Double Sided Through hole plated | | Material | FR4, Polyimide
| | Copper Thickness | 35 micron ; 70 micron | | Copper Laminate Thickness | 0.8mm 1.0mm 1.6mm 2.4mm | | Solder Mask | Liquid Photo Image -Dark Green, Blue | | Silkscreen Legend | White | | Edge Profile | V-score or smoothed | | Board Supply | Panel or individual | | Inspection | Optical | | Single Sided Finish | Immersion Silver, SMOBC (solder mask over bare copper) | | Through Hole Plated Finish | Immersion Silver
| | Film imaging resolution | 2000dpi - 2400dpi | Data files accepted
| Gerber RS274-X, Gerber RS274-D | Slot Drill Size Available
| 0.8mm, 1.0mm, 1.1mm, 1.2mm, 1.5mm, 1.8mm 2mm, 2.5mm, 3mm |
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